(footprint "KINGCONN_7MSDP-FA-0024_MicroSD_PushPush" (version 20221018) (generator kingconn_drawing_to_footprint)
  (layer "F.Cu")
  (descr "KINGCONN 7MSDP-FA-0024 micro-SD push-push, H=1.28mm. Land pattern extracted from KINGCONN drawing 7MSDP-FA-0024 rev A sheet 2 and verified against the printed dimensions.")
  (tags "connector micro-sd microsd push-push kingconn")
  (attr smd)
  (fp_text reference "J**" (at 0 -2.2) (layer "F.SilkS"))
  (fp_text value "KINGCONN_7MSDP-FA-0024_MicroSD_PushPush" (at 0 2.55) (layer "F.Fab"))
  (pad "DSW2" smd rect (at 1.373 -12.490) (size 1.050 0.783) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "DSW1" smd rect (at 5.641 -12.417) (size 0.898 0.930) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at -5.011 -11.216) (size 0.699 3.330) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at 7.952 -11.216) (size 0.699 3.330) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at -4.929 -0.452) (size 0.861 2.800) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "8" smd rect (at -3.850 0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "7" smd rect (at -2.750 -0.000) (size 0.704 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "6" smd rect (at -1.649 -0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at -0.552 -0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at 0.552 -0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at 1.649 -0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at 2.750 -0.000) (size 0.704 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "1" smd rect (at 3.850 -0.000) (size 0.699 1.203) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at 7.732 0.034) (size 1.140 1.828) (layers "F.Cu" "F.Paste" "F.Mask"))
)