(footprint "KINGCONN_7MSDP-F0-0037_MicroSD_PushPush" (version 20221018) (generator kingconn_drawing_to_footprint)
  (layer "F.Cu")
  (descr "KINGCONN 7MSDP-F0-0037 micro-SD push-push, H=1.29mm. Land pattern extracted from KINGCONN drawing 7MSDP-F0-0037 rev A and verified against 22 printed dimensions.")
  (tags "connector micro-sd microsd push-push kingconn")
  (attr smd)
  (fp_text reference "J**" (at 0 -2.2) (layer "F.SilkS"))
  (fp_text value "KINGCONN_7MSDP-F0-0037_MicroSD_PushPush" (at 0 16.92) (layer "F.Fab"))
  (pad "9" smd rect (at -4.726 0.177) (size 1.180 0.850) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "10" smd rect (at -3.467 0.177) (size 0.632 0.850) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "11" smd rect (at 2.875 0.175) (size 0.654 0.850) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at 6.014 0.177) (size 1.203 0.850) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "8" smd rect (at -4.775 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "7" smd rect (at -3.775 12.064) (size 0.601 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "6" smd rect (at -2.775 12.064) (size 0.601 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at -1.775 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at -0.775 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at 0.225 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at 1.225 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "1" smd rect (at 2.225 12.064) (size 0.602 0.805) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at -3.279 13.305) (size 0.602 0.684) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at 0.725 13.305) (size 0.594 0.684) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at -6.463 14.756) (size 0.744 1.195) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "9" smd rect (at 6.597 14.876) (size 0.985 0.895) (layers "F.Cu" "F.Paste" "F.Mask"))
)