(footprint "KINGCONN_7MSDP-AA-1110_MicroSD_PushPush_Reverse" (version 20221018) (generator kingconn_drawing_to_footprint)
  (layer "F.Cu")
  (descr "KINGCONN 7MSDP-AA-1110 micro-SD push-push reverse type. Land pattern extracted from KINGCONN drawing 7MSDP-AA-1110-B rev B sheet 2 and verified against the printed dimensions.")
  (tags "connector micro-sd microsd push-push reverse kingconn")
  (attr smd)
  (fp_text reference "J**" (at 0 -2.2) (layer "F.SilkS"))
  (fp_text value "KINGCONN_7MSDP-AA-1110_MicroSD_PushPush_Reverse" (at 0 17.20) (layer "F.Fab"))
  (pad "SH" smd rect (at -7.400 -0.098) (size 1.697 1.500) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at 5.249 -0.098) (size 1.605 1.500) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "1" smd rect (at -3.850 0.000) (size 0.753 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at -2.753 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at -1.652 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at -0.552 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 0.549 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "6" smd rect (at 1.649 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "7" smd rect (at 2.750 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "8" smd rect (at 3.850 0.000) (size 0.747 1.697) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SW1" smd rect (at 5.900 1.549) (size 1.297 1.297) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SW2" smd rect (at 5.900 8.951) (size 1.297 1.402) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at -7.702 14.748) (size 1.500 1.703) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "SH" smd rect (at 5.799 14.748) (size 1.500 1.703) (layers "F.Cu" "F.Paste" "F.Mask"))
)